System dedicated to the deposition of thin and ultra-thin films deposited by electron beam evaporation.
The electron beam evaporation is a physical vapor deposition in which high-energy electrons impinge on the material to be deposited, typically in the form of rods or pellets, inducing its sublimation and the following deposition on a substrate. Inside the vacuum chamber, the target material is placed in a pocket crucible where it is easily irradiated by the electron beam. The system employs a multi-crucible system that allows the deposition of multilayers. To improve the homogeneity of deposition, the substrates are mounted on a rotating holder whose speed can be controlled by the operator.
This technique is indicated for deposition of thin films of metals, semi-metals, oxides and fluorides with thickness ranging from few monolayers to few µm.
TECHNICAL SPECIFICATIONS
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Base pressure: <10-8 mbar;
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Electron gun up to 1.5 kW controlled by Temescal TemEBeam EBC
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System allows to hold four crucibles of different materials to be deposited
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Film thickness monitored by a quartz crystal microbalance.
AVAILABLE TECHNIQUES
- - e-beam evaporation
Samples
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Up to 6-inch wafers
USE FOR
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metals
English (UK) 
Italiano (Italia)